Semiconductor Device Assembly
SM-D-818263
Light emitting diode 3; bracket 1 major components
| DAC | HCC | DMIL | RNCC |
|---|---|---|---|
| A | - | - | 3 |
| RNVC | SADC | MSDS | RNAAC |
|---|---|---|---|
| 2 | - | - | TX |
A grouping of two or more semiconducting devices such as light emitting diode; semiconductor device, diode; semiconductor device, photo; semiconductor device, thyristor; and/or transistor mounted on a common mounting or mounted on each other. The devices must be separable and each item must be capable of functioning in accordance with its given name. For assemblies consisting of semiconducting devices permanently cased, encapsulated, or potted together to form a single unit, see rectifier, semiconductor device, unitized and semiconductor devices, unitized. Excludes:semiconductor device set; microcircuit assembly; and microcircuit set. See also absorber, overvoltage.
| INC | FIIG | Concept | Condition |
|---|---|---|---|
| 35565 | T01200 | - | 2 |
Details
The principal parts that are included in an assembled unit.| HMIC | PMIC | ESD/EMI | Criticality |
|---|---|---|---|
| N | A | - | - |
| UFC | HMC | LTL | LCL |
|---|---|---|---|
| 34525 | - | W | - |
| RVC | WCC | TCC | SHC |
|---|---|---|---|
| - | 72D | Z | 9 |
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What is the NIIN of the NSN 6030-01-162-6624?
When the NSN 6030-01-162-6624 was assigned to the Federal Catalog?
Does the NSN 6030-01-162-6624 contain any precious metals?
Does the NSN 6030-01-162-6624 contain any hazardous material?
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