Backplane Assembly
Zzzy criticality code justification, material will be in accordance with navicp activity hx quality control, manufacturing and testing specifications reference number differentiating characteristics
| DAC | HCC | DMIL | RNCC |
|---|---|---|---|
| C | - | - | 3 |
| RNVC | SADC | MSDS | RNAAC |
|---|---|---|---|
| 1 | - | - | HA |
An insulating panel upon which two or more connector, receptacle, electrical, are mounted, and completely processed electrical conductor paths are deposited, etched, or printed in various paths. It provides or completes a circuit between two or more circuit card assembly or electronic components assembly. It may be designed for panel or chassis mounting, or for insertion into a connector, receptacle, electrical. Includes motherboards. For items containing processed electrical conductor paths and contacts for plug-in connecting facilities, see printed wiring board. See also printed circuit board; circuit card assembly and cable assembly, printed, flexible.
| INC | FIIG | Concept | Condition |
|---|---|---|---|
| 34736 | A511K0 | - | 1 |
Details
The master requirement codes of those requirements which are technically critical by reason of tolerance,fit,performance,or other characteristics which affect identification of the item.Details
A feature of the item of supply which must be specifically recorded when the reference number covers a range of items.| HMIC | PMIC | ESD/EMI | Criticality |
|---|---|---|---|
| N | A | A | - |
| UFC | HMC | LTL | LCL |
|---|---|---|---|
| 34580 | - | W | - |
| RVC | WCC | TCC | SHC |
|---|---|---|---|
| - | 72D | Z | 9 |
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What is the NIIN of the NSN 5998-01-473-7923?
When the NSN 5998-01-473-7923 was assigned to the Federal Catalog?
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