Backplane Assembly
Bp,pxi 25sl, 6u dual stack, 3-lbp end item identification
| DAC | HCC | DMIL | RNCC |
|---|---|---|---|
| 6 | - | - | 3 |
| RNVC | SADC | MSDS | RNAAC |
|---|---|---|---|
| 2 | - | - | 9Z |
An insulating panel upon which two or more connector, receptacle, electrical, are mounted, and completely processed electrical conductor paths are deposited, etched, or printed in various paths. It provides or completes a circuit between two or more circuit card assembly or electronic components assembly. It may be designed for panel or chassis mounting, or for insertion into a connector, receptacle, electrical. Includes motherboards. For items containing processed electrical conductor paths and contacts for plug-in connecting facilities, see printed wiring board. See also printed circuit board; circuit card assembly and cable assembly, printed, flexible.
| INC | FIIG | Concept | Condition |
|---|---|---|---|
| 34736 | A511K0 | - | 1 |
Details
The national stock number or the identification information of the end equipment for which the item is a part.| HMIC | PMIC | ESD/EMI | Criticality |
|---|---|---|---|
| N | A | A | - |
| UFC | HMC | LTL | LCL |
|---|---|---|---|
| - | - | - | - |
| RVC | WCC | TCC | SHC |
|---|---|---|---|
| - | - | - | - |
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What is the NIIN of the NSN 5998-01-594-6152?
When the NSN 5998-01-594-6152 was assigned to the Federal Catalog?
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Does the NSN 5998-01-594-6152 contain any hazardous material?
What is the ESD classification of NSN 5998-01-594-6152?
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