Semiconductor Device Assembly
Arsr4 end item identification
| DAC | HCC | DMIL | RNCC |
|---|---|---|---|
| 5 | - | - | 3 |
| RNVC | SADC | MSDS | RNAAC |
|---|---|---|---|
| 2 | - | - | ZZ |
A grouping of two or more semiconducting devices such as light emitting diode; semiconductor device, diode; semiconductor device, photo; semiconductor device, thyristor; and/or transistor mounted on a common mounting or mounted on each other. The devices must be separable and each item must be capable of functioning in accordance with its given name. For assemblies consisting of semiconducting devices permanently cased, encapsulated, or potted together to form a single unit, see rectifier, semiconductor device, unitized and semiconductor devices, unitized. Excludes:semiconductor device set; microcircuit assembly; and microcircuit set. See also absorber, overvoltage.
| INC | FIIG | Concept | Condition |
|---|---|---|---|
| 35565 | T01200 | - | 2 |
Details
The national stock number or the identification information of the end equipment for which the item is a part.| HMIC | PMIC | ESD/EMI | Criticality |
|---|---|---|---|
| N | A | A | - |
| UFC | HMC | LTL | LCL |
|---|---|---|---|
| - | - | - | - |
| RVC | WCC | TCC | SHC |
|---|---|---|---|
| - | - | - | - |
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What is the NIIN of the NSN 5961-01-465-1602?
When the NSN 5961-01-465-1602 was assigned to the Federal Catalog?
Does the NSN 5961-01-465-1602 contain any precious metals?
Does the NSN 5961-01-465-1602 contain any hazardous material?
What is the ESD classification of NSN 5961-01-465-1602?
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