Transistor
Glass inclosure material, silicon semiconductor material, 4 uninsulated wire lead terminal type and quantity
DAC | HCC | DMIL | RNCC |
---|---|---|---|
6 | - | - | 3 |
RNVC | SADC | MSDS | RNAAC |
---|---|---|---|
2 | - | - | 9Z |
An active semiconductor device with three or more electrodes. May or may not include mounting hardware and/or heatsink. Excludes:semiconductor device, diode and semiconductor device, thyristor. For solid state devices which are responsive to visible or infrared radiant energy, see semiconductor device, photo.
INC | FIIG | Concept | Condition |
---|---|---|---|
20588 | A110A0 | - | 1 |
Details
The element,compound,or mixture of which the inclosure is fabricated,excluding any surface treatment. please use mrc cqsj in place of this discontinued mrc.Details
The chemical compound or mechanical mixture properties of which the semiconductor is fabricated.Details
Indicates the type and number of terminals for providing electrical connection.Part | CAGE | DAC | HCC | RNCC | RNVC | MSDS | RNAAC |
---|---|---|---|---|---|---|---|
SDSW0024 | 73293 | 6 | - | 5 | 9 | - | 9Z |
HMIC | PMIC | ESD/EMI | Criticality |
---|---|---|---|
N | A | A | - |
UFC | HMC | LTL | LCL |
---|---|---|---|
- | - | - | - |
RVC | WCC | TCC | SHC |
---|---|---|---|
- | - | - | - |
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What is the NIIN of the NSN 5961-00-007-9132?
When the NSN 5961-00-007-9132 was assigned to the Federal Catalog?
Does the NSN 5961-00-007-9132 contain any precious metals?
Does the NSN 5961-00-007-9132 contain any hazardous material?
What is the ESD classification of NSN 5961-00-007-9132?
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